Scintillator panel and method of manufacturing radiation image sensor

ABSTRACT

An auxiliary substrate  20  is overlapped onto a thin substrate  11 , and substrate  11  and auxiliary substrate  20  are covered with an organic film  12 . Thereafter, a scintillator  13  is formed on a scintillator forming portion  12 A of organic film  12  that corresponds to substrate  11 . Here, since thickness is added to substrate  11  by auxiliary substrate  20 , the warping of substrate  11  is prevented and scintillator  13  is formed uniformly.

TECHNICAL FIELD

This invention relates to a scintillator panel and a radiation imagesensor for X-ray image taking for medical and industrial applications,etc., and a manufacturing method of the same.

BACKGROUND ART

Conventionally X-ray sensitive films have been used for medical orindustrial X-ray image taking, but the use of radiation imaging systemsusing radiation image sensors is spreading due to the aspects ofconvenience and preservation of the image taking results. With such aradiation imaging system, a radiation image is acquired astwo-dimensionally arrayed pixel data in the form of electrical signalsby means of a radiation image sensor, and the signals are processed by aprocessing device and displayed on a monitor. A scintillator panel, inwhich a scintillator is formed by vapor depositing scintillatorcomponents onto a substrate of aluminum, glass, or fused silica, etc.,is used in the radiation image sensor, and such a scintillator panel isdisclosed, for example, in Japanese Patent No. 3,126,715 and No.3,034,010.

To describe a conventional manufacturing method of this type ofscintillator panel with reference to FIG. 38A, a substrate 61 isinserted inside a vacuum vapor deposition device and end portions ofsubstrate 61 are set on a holding jig 70, 70, disposed in the vacuumvapor deposition device. Here, a scintillator vapor deposition surface61A of substrate 61 is positioned at the lower side. When substrate 61has been set inside the vacuum vapor deposition device by means ofholding jig 70, 70, scintillator materials are vapor deposited ontoscintillator vapor deposition surface 61A of substrate 61 to form ascintillator 62. A scintillator panel 60, with which scintillator 62 isformed on scintillator vapor deposition surface 61A, is therebymanufactured as shown in FIG. 38B.

DISCLOSURE OF THE INVENTION

With increasing range of radiation image sensors spreading into newterritories in recent years, slimming down of the substrate, enlargingthe scintillator forming surface, etc., are being demanded.

For example, for improving the radiation transmittance at low energies,slimming down of the substrate is desired. However, in an attempt tomanufacture a scintillator panel with a thin substrate by theabove-described conventional method, the substrate becomes warped by itsown weight when end portions of the substrate are placed on the holdingjig and there will be a problem that scintillator cannot be vapordeposited uniformly. This problem tends to occur especially when asubstrate of large area is used. Unlike a visible light image, aradiation image cannot be reduced in size using an optical system, andthe above problem tends to occur readily since a scintillator panel of alarge area in the excess of 30 centimeters square is required, forexample, in chest X-ray image taking.

Meanwhile, a scintillator panel, for a radiation image sensor for dentaluse that is used by inserting inside an oral cavity, must be made ascompact as possible and yet made large in image pickup area.

However, with the above-described conventional manufacturing method, theend portions of scintillator vapor deposition surface 61A are held byholding jig 70 of the vacuum vapor deposition device in the process offorming scintillator 62. Thus the entire surface of the scintillatorvapor deposition surface 61A is not necessarily exposed, andscintillator 62 is not formed at the end portions that are not exposed.As a result, the area of surface 62A of scintillator 62 becomes smallrelative to the area of scintillator vapor deposition surface 61A ofsubstrate 61, and the image pickup area becomes small in comparison tothe entire area.

Also, since holding jig 70 is positioned at the end portions ofscintillator vapor deposition surface 61A, the surface of scintillator62 is formed in an inclining slope-like manner at the end portions. Thusfor example, when an adhesive agent is used to adhere an image pickupelement to scintillator 62 across an organic film in order tomanufacture an imaging panel, the adhesive agent concentrates at theslope-like portions and distortion occurs when the adhesive agentsolidifies.

Therefore, it is an object of the present invention to provide amanufacturing method of a scintillator panel and a radiation imagesensor, with which the slimming down of the substrate and enlarging thearea proportion of the scintillator forming surface on the substrate arefacilitated.

In order to achieve the above object, a manufacturing method of ascintillator panel according to the present invention is characterizedin a manufacturing method of a scintillator panel, wherein ascintillator is vapor deposited onto a substrate, comprising the stepsof: (1) overlapping an auxiliary substrate onto a predetermined positionof a first surface of the substrate; (2) collectively covering theentire overlapped substrate and auxiliary substrate with an organicfilm; (3) holding the substrate and the auxiliary substrate, which arecovered by the organic film, by means of a holding portion inside avapor deposition device; (4) vapor depositing the scintillator onto asurface of the organic film that covers a second surface of thesubstrate at the side opposite the first surface in this state; and (5)cutting the organic film at predetermined positions and separating thesubstrate from the auxiliary substrate to provide a scintillator panel,with which the organic film and the scintillator are formed on thesecond surface of the substrate.

With the manufacturing method for the scintillator panel according tothe present invention, an auxiliary substrate is overlapped onto asubstrate in forming a scintillator on the substrate. Since theauxiliary substrate is overlapped onto the substrate, warping of thesubstrate due to its own weight or the weight of the scintillator can beprevented in forming the scintillator. The warping of the substrate islikewise prevented even when the substrate has a large area. Thescintillator can thus be formed uniformly on the substrate even when thesubstrate is thin or large in area.

Also, a manufacturing method of a scintillator panel according to thepresent invention is characterized in a manufacturing method of ascintillator panel, wherein a scintillator is vapor deposited onto anorganic film, comprising the steps of: (1) covering at least a firstsurface of a predetermined auxiliary substrate with the organic film;(2) holding the auxiliary substrate, covered by the organic film, bymeans of a holding portion inside a vapor deposition device; (3) vapordepositing the scintillator onto a predetermined position of an exposedsurface of the organic film at the side opposite the surface contactingthe first surface of the auxiliary substrate in this state; and (4)separating the organic film, on which the scintillator is formed, fromthe auxiliary substrate.

By thus forming a scintillator on an organic film disposed on anauxiliary substrate and thereafter separating the organic film, on whichthe scintillator is formed, from the auxiliary substrate, a scintillatorpanel having the organic film itself as the substrate can be formed. Bymaking thin the organic film provided here, a state wherein thescintillator is formed on a thin substrate can be realized. The sameeffects as those of the above-described case of manufacturing ascintillator panel by adding an auxiliary substrate to a substrate canbe obtained in this case as well.

Preferably, a step of covering the organic film, having the scintillatorand being separated from the auxiliary substrate, with a protective filmis also included. The scintillator can thereby be prevented fromcontacting external air and undergoing deliquescence due to the moisturecontained in the air and other physical and chemical degradation,damage, etc.

A step of setting and fixing the organic film, having the scintillatorand being separated from the auxiliary substrate, on a substrate uponmaking either the surface, which was in contact with the first surfaceof the auxiliary substrate, or the scintillator forming surface of theorganic film face the substrate may furthermore be provided. By thussetting the scintillator forming surface or the scintillator on aseparate substrate, a scintillator panel can be manufactured. Bypreparing a thin substrate, a thin scintillator panel can bemanufactured.

Preferably, a step of forming a protective film that covers thescintillator is furthermore provided. In covering the scintillator withthe protective film, it is sufficient that the exposed portions of thescintillator be covered, and just the scintillator may be covered by theprotective film or at least one among the scintillator forming portionand the substrate may be covered along with the scintillator by theprotective film.

These substrates are preferably radiation transmitting substrates, andas such a radiation transmitting substrate, glass, aluminum, oramorphous carbon may be used. By using a radiation transmittingsubstrate as the substrate, a scintillator panel of an embodimentwherein radiation is transmitted from the back side of the substrate canbe arranged.

A step of forming a metal reflecting film between the substrate and thescintillator may be provided. The luminance of the light emitted fromthe scintillator can thereby be increased.

A fiber optic plate may be used as the substrate. Light converted fromradiation by the scintillator can then be emitted from the substratewith high spatial resolution.

The auxiliary substrate has protruding portions that protrude to theouter sides of the substrate as viewed from the first surface side andis held by the holding portion inside the vapor deposition device by useof these protruding portions. Or, the auxiliary substrate may haveprotruding portions that protrude in the direction of the substratethickness and opposite the first surface and be held by the holdingportion inside the vapor deposition device by use of these protrudingportions. Or, the auxiliary substrate may have engaging portions at sidewall portions and be held by the holding portion inside the vapordeposition device by use of these engaging portions.

By thus holding the substrate using the auxiliary substrate, the entiresurface of the scintillator forming surface of the substrate can beexposed inside a vapor deposition chamber and a uniform scintillatorlayer can be formed over the entire forming surface. A scintillatorpanel, having a scintillator area substantially equal to the substratearea, can thus be prepared. The substrate can be held securely by theauxiliary substrate.

The radiation image sensor according to the present invention ischaracterized in having a step of mounting the scintillator panelmanufactured by the above-described manufacturing method onto a lightreceiving surface of a solid-state image pickup element.

Specifically, the method comprises the steps of: (1) overlapping anauxiliary substrate onto a predetermined position of a first surface ofa substrate; (2) collectively covering an entire the overlappedsubstrate and the auxiliary substrate with an organic film; (3) holdingthe substrate and the auxiliary substrate, which are covered by theorganic film, by means of a holding portion inside a vapor depositiondevice; (4) vapor depositing a scintillator on a surface of the organicfilm that covers a second surface of the substrate at the side oppositethe first surface in this state; (5) cutting the organic film atpredetermined positions and separating the substrate from the auxiliarysubstrate to provide a scintillator panel, with which the organic filmand the scintillator are formed on the second surface of the substrate;and (6) adhering the scintillator panel onto a light receiving surfaceof a solid-state image pickup element.

Or, after the steps of (1) to (4), the method may comprise the steps of:(4a) adhering the scintillator forming surface onto a light receivingsurface of a solid-state image pickup element; and (5a) cutting theorganic film at predetermined positions and separating the substratefrom the auxiliary substrate to provide a radiation image sensor, havinga scintillator panel positioned on the light receiving surface of thesolid-state image pickup element.

Or, the method may comprise the steps of: (1) covering at least a firstsurface of a predetermined auxiliary substrate with an organic film; (2)holding the auxiliary substrate, covered by the organic film, by meansof a holding portion inside a vapor deposition device; (3) vapordepositing a scintillator on a predetermined position of an exposedsurface of the organic film at the side opposite the surface contactingthe first surface of the auxiliary substrate in this state; (4)separating the organic film, on which the scintillator is formed, fromthe auxiliary substrate; and (5) mounting the surface at the sideopposite the scintillator forming surface or the scintillator formingsurface of the organic film with the scintillator onto a light receivingsurface of a solid-state image pickup element.

By thus mounting the scintillator, formed on the substrate or the film,onto the solid-state image pickup element, a radiation image sensor,with which the scintillator is formed uniformly on the substrate that isthin or large in area, can be manufactured. For the mounting of thescintillator or the substrate on the light receiving surface of thesolid-state image pickup element, besides the embodiment directlymounting the scintillator or the substrate, an embodiment mounting viaan organic film or a protective film is also possible. In order toprevent deliquescence, etc., of the scintillator, the scintillator ispreferably covered with a protective film, and in this case, the exposedportions of the scintillator are covered. In regard to covering theexposed portions of the scintillator, besides the embodiment coveringjust the scintillator with the protective film, an embodiment coveringat least one among the scintillator forming portion, the substrate, andthe solid-state image pickup element along with the scintillator is alsopossible.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a sectional view of a scintillator panel manufactured by ascintillator panel manufacturing method according to a first embodimentof the present invention, and FIG. 1B is a plan view thereof.

FIG. 2A to FIG. 6 (FIG. 2A, FIG. 2B, FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B,FIG. 5A, FIG. 5B, and FIG. 6) are diagrams for describing thescintillator panel manufacturing method according to this firstembodiment.

FIG. 7 and FIG. 8 are sectional views for describing a portion of thesteps of a scintillator panel manufacturing method according to a secondembodiment.

FIG. 9A is a sectional view of a scintillator panel manufactured by ascintillator panel manufacturing method of a third embodiment, and FIG.9B is a sectional view of a modification example thereof.

FIG. 10A to FIG. 12 (FIG. 10A, FIG. 10B, FIG. 11A, FIG. 11B, and FIG.12) are diagrams for describing the scintillator panel manufacturingmethod according to the third embodiment.

FIG. 13A is a sectional view of a scintillator panel manufactured by ascintillator panel manufacturing method according to a fourthembodiment, and FIG. 13B is a front view thereof.

FIG. 14A is a sectional view of a scintillator panel manufactured by ascintillator panel manufacturing method according to a fifth embodiment,and FIG. 14B is a front view thereof.

FIG. 15A is a sectional view of a scintillator panel manufactured by ascintillator panel manufacturing method according to a sixth embodiment,and FIG. 15B is a front view thereof.

FIG. 16A, FIG. 16B, and FIG. 17 are diagrams for describing thescintillator panel manufacturing method according to the sixthembodiment.

FIG. 18A is a sectional view of a radiation detector manufactured by aradiation image sensor manufacturing method according to a seventhembodiment, and FIG. 18B is a front view thereof.

FIG. 19A, FIG. 19B, FIG. 20, and FIG. 21 are diagrams for describing theradiation detector manufacturing method according to the seventhembodiment.

FIG. 22A is a sectional view of a radiation image sensor according to aneighth embodiment, and FIG. 22B is a front view thereof.

FIG. 23A is a sectional view of a radiation image sensor according to aninth embodiment, and FIG. 23B is a front view thereof.

FIG. 24A is a sectional arrangement diagram of a scintillator panelmanufactured by a manufacturing method according to a tenth embodimentof this invention, and FIG. 24B is a front view thereof.

FIG. 25A to FIG. 29 (FIG. 25A, FIG. 25B, FIG. 26A, FIG. 26B, FIG. 27A,FIG. 27B, FIG. 28, and FIG. 29) are diagrams for describing thisscintillator panel manufacturing method according to the tenthembodiment.

FIG. 30A is a sectional view of a radiation image sensor using thescintillator panel of FIG. 24A and FIG. 30B is a sectional view of acorresponding radiation image sensor manufactured by the conventionalmanufacturing method.

FIG. 31A and FIG. 31B are schematic diagrams showing radiation imagesobtained by the radiation image sensors of FIG. 30A and FIG. 30B,respectively.

FIG. 32, FIG. 33, FIG. 34A, and FIG. 34B are perspective views fordescribing other forms of a support substrate.

FIG. 35 and FIG. 36 are explanatory diagrams showing portions of aprocess of manufacturing a scintillator panel using the supportsubstrate shown in FIG. 34A.

FIG. 37A and FIG. 37B are sectional views showing modification examplesof the first embodiment.

FIG. 38A is a sectional view showing a portion of a conventionalscintillator panel manufacturing process and FIG. 38B is a sectionalview of the conventional scintillator panel.

BEST MODES FOR CARRYING OUT THE INVENTION

Preferred embodiments of the present invention shall now be describedspecifically with reference to the drawings. To facilitate thecomprehension of the explanation, the same reference numerals denote thesame parts, where possible, throughout the drawings, and a repeatedexplanation will be omitted. Also, to facilitate the the comprehensionof the explanation, each drawing has exaggerated or omitted portions andthe dimensional proportions thereof are not necessarily in agreementwith actuality.

FIG. 1A is a sectional view of a scintillator panel manufactured by amanufacturing method of a first embodiment, and FIG. 1B is a plan viewthereof. As shown in FIG. 1A and FIG. 1B, scintillator panel 1 of thisembodiment has a radiation-transmitting substrate 11, composed of glassor amorphous carbon or other material having carbon as the maincomponent. On one surface of substrate 11 (the upper surface in FIG. 1A)is formed an organic film 12, which covers the one surface of substrate11. Organic film 12 covers the entire one surface of substrate 11 and isformed continuously across the side surfaces of substrate 11. Substrate11 is a thin substrate and although it has a rectangular shape in planview, it may instead have a circular shape, etc., in plan view. Organicfilm 12 is composed of a xylene-based resin, such as polyparaxylylene(parylene (trade name), made by Three Bond Co., Ltd.),polyparachloroxylylene (parylene C (trade name), made by Three Bond Co.,Ltd.).

On the surface of organic film 12 is formed a scintillator 13 thatconverts radiation, which enters upon being transmitted throughsubstrate 11, to visible light or other light of a predeterminedwavelength. For example, Tl-doped CsI is used in scintillator 13, andCsI has a structure wherein a plurality of needle-like crystals(columnar crystals) are bristled together. This scintillator 13 isformed by vapor deposition on the surface of a scintillator formingportion 12A, which is a portion of organic film 12 positioned at aposition corresponding to substrate 11.

Furthermore, around substrate 11, organic film 12, and scintillator 13is provided a protective film 14 that is formed so as to cover thesecomponents entirely. As with organic film 12, protective film 14 iscomposed of polyparaxylylene, polyparachloroxylylene or otherxylene-based resin. By the provision of this protective film 14,deliquescence of scintillator 13 due to contact of scintillator 13 withexternal air is prevented.

A process of manufacturing this scintillator panel 1 shall now bedescribed with reference to FIG. 2A to FIG. 6. In manufacturingscintillator panel 1, an auxiliary substrate 20, shown in FIG. 2A toFIG. 5, is used. To describe the process of manufacturing scintillatorpanel 1, first as shown in FIG. 2A and FIG. 2B, substrate 11 is set onauxiliary substrate 20 for scintillator forming to overlap substrate 11onto auxiliary substrate 20. As shown in FIG. 2B, auxiliary substrate 20has the same rectangular shape as substrate 11 as its planar shape andthe thickness thereof is thicker than that of substrate 11. Also,substrate 11 is simply set on auxiliary substrate 20 and is not adhered,etc.

Substrate 11 and auxiliary substrate 20, which have thus beenoverlapped, are covered with organic film 12 as shown in FIG. 3A andFIG. 3B. Although substrate 11 and auxiliary substrate 20, which arecovered with organic film 12, are not adhered together, these componentsare fastened together and put in a state of close contact by organicfilm 12. Also, since substrate 11 and auxiliary substrate 20 are thesame in the shape in plan view, they are overlapped without becomingdeviant with respect to each other. Upon covering substrate 11 andauxiliary substrate 20 with organic film 12, scintillator 13 is formedon the surface of scintillator forming portion 12A of organic film 12.Scintillator forming portion 12A of organic film 12 is at the upper sideof substrate 11 and by forming the scintillator on scintillator formingportion 12A, a state wherein scintillator 13 is formed on substrate 11across scintillator forming portion 12A is realized.

Here in forming scintillator 13, substrate 11 is suspended by holding itin a state where both ends of substrate 11 are held by a holding portion81 of a vapor deposition device 80 as shown in FIG. 4A and FIG. 4B, andby vaporizing scintillator components from a vapor deposition chamber 82at the lower side and vapor depositing the scintillator components ontothe portion of substrate 11 that is exposed from opening 81A of holdingportion 81, needle-like crystals are grown. Here, if the thin substrate11 alone is just suspended on holding portion 81, substrate 11 maybecome warped by its own weight or the weight of the depositedscintillator. When substrate 11 thus becomes warped, the scintillatormay not be formed uniformly on the substrate. In regard to this point,with the scintillator panel manufacturing method of this embodiment, indepositing the scintillator, substrate 11 and auxiliary substrate 20 areoverlapped and these components are covered and thereby integrated byorganic film 12 so that the state in which substrate 11 and auxiliarysubstrate 20 are overlapped is maintained. Since this auxiliarysubstrate 20 acts as a reinforcing plate, the warping of substrate 11can be prevented effectively and the scintillator can be formeduniformly on one surface of substrate 11.

When scintillator 13 has thus been formed to a desired thickness onscintillator forming portion 12A of organic film 12 as shown in FIG. 5Aand FIG. 5B, the entirety is taken out from vapor deposition device 80,and as shown in FIG. 6, organic film 12 is cut at the boundary portionsbetween substrate 11 and auxiliary substrate 20. The cut portions areindicated by the symbol 12B. Here, since substrate 11 and auxiliarysubstrate 20 are not adhered, etc., scintillator forming portion 12A, onwhich scintillator 13 has been formed, and substrate 11 are separatedfrom auxiliary substrate 20 by the cutting of organic film 12 at cutportions 12B. As a result, a scintillator panel 1 a, having scintillator13 formed via scintillator forming portion 12A on thin substrate 11, isprovided.

Auxiliary substrate 20, which has been separated from substrate 11,etc., may be rejected as it is or may be washed, etc., and then reusedas auxiliary substrate 20. By then entirely covering the entirescintillator panel 1 a, comprising substrate 11, organic film 12, andscintillator 13, by protective film 14, scintillator panel 1, shown inFIG. 1A and FIG. 1B can be manufactured.

With scintillator panel 1 that has thus been manufactured, although athin substrate 11 is used, the warping of substrate 11 in the process offorming scintillator 13 is prevented by auxiliary substrate 13.Scintillator 13 can thus be formed uniformly on substrate 11. Moreover,even if substrate 11 is of a large area, since auxiliary substrate 20can favorably prevent the warping of substrate 11, scintillator 13 canbe formed uniformly on substrate 11. Although in the present embodiment,substrate 11 and auxiliary substrate 20 are covered entirely by organicfilm 12, an embodiment, wherein these are not covered entirely butsubstrate 11 and auxiliary substrate 20 are covered by organic film 12just to a degree to which these will not separate during the forming ofscintillator 13, is also possible.

A second embodiment of the present invention shall now be described.With this embodiment, as with the above-described first embodiment,first, substrate 11 and auxiliary substrate 20 are overlapped (FIG. 2Aand FIG. 2B), substrate 11 and auxiliary substrate 20 are covered byorganic film 12 (FIG. 3A and FIG. 3B), and scintillator 13 is formed onthe surface of scintillator forming portion 12A of organic film 12 (FIG.4A, FIG. 4B, 5A, and FIG. 5B). The procedures up to this point are thesame as those of the first embodiment described above.

When scintillator 13 has thus been formed on the surface of scintillatorforming portion 12A as shown in FIG. 7, organic film 12, which coverssubstrate 11 and auxiliary substrate 20, and scintillator 13, formed onscintillator forming portion 12A, are covered entirely by protectivefilm 14. Then as shown in FIG. 8, organic film 12 and protective film 14are cut at the boundary portions (cut portions 12B, 12B, 14A and 14A) ofsubstrate 11 and auxiliary substrate 20. Since substrate 11 andauxiliary substrate 20 are not adhered, etc., scintillator formingportion 12A, on which scintillator 13 has been formed, and substrate 11are separated from auxiliary substrate 20. As a result, a scintillatorpanel 2, having scintillator 13 formed via scintillator forming portion12A on the thin substrate 11 and having scintillator 13 covered withprotective film 14, is provided.

With scintillator panel 2, which is manufactured in the above-describedmanner, as with the above-described first embodiment, the warping ofsubstrate 11 in the process of forming scintillator 13 is prevented byauxiliary substrate 20. Scintillator 13 can thus be formed uniformly onsubstrate 11. Moreover, even if substrate 11 is of a large area, sinceauxiliary substrate 20 can favorably prevent the warping of substrate11, scintillator 13 can be formed uniformly on substrate 11.

Next, a third embodiment of the present invention shall now bedescribed. FIG. 9A is a sectional view of a scintillator panelmanufactured by a manufacturing method according to this embodiment, andFIG. 9B is a sectional view of a modification example thereof. As shownin FIG. 9A, with the scintillator panel 3 according to the presentembodiment, scintillator 13 is formed on one surface of organic film 12,composed of polyparaxylylene, polyparachloroxylylene, or otherxylene-based material, and organic film 12 and scintillator 13 arecovered entirely by protective film 14. That is, with the presentembodiment, organic film 12 serves in common as substrate 11.

To describe the method of manufacturing this scintillator panel, firstas shown in FIG. 10A and FIG. 10B, auxiliary substrate 20 forscintillator forming is prepared and the entirety of this auxiliarysubstrate is covered by organic film 12. This auxiliary substrate 20 hascertain thickness and obviously it is preferably thicker than organicfilm 12 that is to be formed in particular. When auxiliary substrate 20is covered by organic film 12, scintillator 13 is formed on scintillatorforming portion 12A of the organic film 12 surface as shown in FIG. 11Aand FIG. 11B. In forming scintillator 13, in the same manner as in thefirst embodiment shown in FIG. 4A and FIG. 4B, auxiliary substrate 20 issuspended inside vapor deposition 30 so that scintillator formingportion 12A of organic film 12 is positioned at the lower side and thescintillator components are vapor deposited. In this process, ifauxiliary substrate 20 becomes warped due to the weight of auxiliarysubstrate 20 itself or the weight of scintillator 13, scintillator 13may not be formed uniformly. However, with the present embodiment, sinceauxiliary substrate 20 of adequate thickness is used, the warping ofscintillator forming portion 12A of organic film 12 can be prevented andscintillator 13 can be formed uniformly.

When scintillator 13 has thus been formed by vapor depositing thescintillator components, organic film 12 on auxiliary substrate 20 iscut at cut portions 12B at the outer sides of the forming surface ofscintillator 13 as shown in FIG. 12. Here, since organic film 12 isformed just to cover auxiliary substrate 20 and is not adhered, etc., bycutting organic film 12, scintillator forming portion 12A andscintillator 13 on organic film 12 can be separated from auxiliarysubstrate 20 and the lower portions of organic film 12. By then entirelycovering organic film 12 and scintillator 13 with protective film 14,scintillator panel 3, having organic film 12 as the substrate, isformed.

With scintillator panel 3, which is thus manufactured, organic film 12is used as it is as the substrate. Thus by making organic film 12 thin,a scintillator panel having a thin substrate can be manufactured. Withscintillator panel 3 having such a thin organic film substrate 12,organic film 12 is formed on thick auxiliary substrate 20 in the processof forming scintillator 13. Since thickness is added by this auxiliarysubstrate 20 to organic film 12, the warping and tearing of organic film12 during the forming of scintillator 13 can be prevented. Thescintillator can thus be formed uniformly on scintillator formingportion 12A of organic film 12. Moreover, even if scintillator formingportion 12A of organic film 12 is of a large area, since the warping andtearing of scintillator forming portion 12A can be prevented byauxiliary substrate 20, scintillator 13 can be formed uniformly onscintillator forming portion 12A. Although in the present embodiment,scintillator 13 is formed upon covering the entire auxiliary substrate20 with organic film 12, an embodiment is also possible whereinauxiliary substrate 20 is covered not in its entirety but just at aportion including one surface thereof so that scintillator formingportion 12A will not fall off from auxiliary substrate 20 in the processof forming scintillator 13.

Also, as a modification example of the present embodiment, the modeshown in FIG. 9B is possible. With a scintillator panel 30, shown inFIG. 9B, end portions of organic film 12, which is to be the substrate,are bent towards the scintillator 13 side and folded along the sidesurfaces of scintillator 13. By thus folding the end portions ofsubstrate 31, the area of the front side of scintillator panel 30 can bemade substantially the same as the area of the front side ofscintillator 13.

A fourth embodiment of the present invention shall now be described.FIG. 13A is a sectional view of a scintillator panel 32 of thisembodiment, and FIG. 13B is a front view thereof. As shown in FIG. 13Aand FIG. 13B, with scintillator panel 32 of this embodiment,scintillator forming portion 12A is set on substrate 11. This substrate11, scintillator forming portion 12A, and scintillator 13 are coveredentirely by protective film 14. Whereas in the third embodimentdescribed above, scintillator forming portion 12A of organic film 12 isused as it is as the substrate, in the present embodiment, a substrateis provided separately.

To describe the method of manufacturing scintillator panel 32 of thepresent embodiment, first, auxiliary substrate 20 is prepared and theentire auxiliary substrate 20 is covered with organic film 12 in thesame manner as in the third embodiment described above, that is, asshown in FIG. 10A and FIG. 10B. The scintillator components are thenvapor deposited onto scintillator forming portion 12A of organic film 12to form scintillator 13 as shown in FIG. 11A and FIG. 11B. Whenscintillator 13 is formed, organic film 12 is cut at cut portions 12B asshown in FIG. 12 and organic film is thereby cut vertically to separatescintillator forming portion 12A of organic film 12 from auxiliarysubstrate 20. The manufacturing steps up to this point are the same asthose of the third embodiment described above.

When scintillator forming portion 12A and scintillator 13 have beenseparated from auxiliary substrate 20, scintillator forming portion 12Ais set on substrate 11 with the surface that had been in contact withauxiliary substrate 20 facing substrate 11. Substrate 11, scintillatorforming portion 12A, and scintillator 13 are then covered entirely withprotective film 14, thereby manufacturing scintillator panel 32.

With scintillator panel 32 thus manufactured, by using a thin substrateas substrate 11, the thickness of scintillator panel 32 itself can bemade thin. Also, even if a thin substrate is used as substrate 11, sinceauxiliary substrate 20, which is thick, is used to prevent the warpingand tearing of scintillator forming portion 12A in the process offorming scintillator 13, scintillator 13 can be formed uniformly onscintillator forming portion 12A.

A fifth embodiment of this invention shall now be described. FIG. 14A isa sectional view of a scintillator panel manufactured by a manufacturingmethod according to the present embodiment, and FIG. 14B is a front viewthereof. As shown in FIG. 14A and FIG. 14B, although scintillator 13 isset on substrate 11 in this scintillator panel 33, this scintillator 13is formed on scintillator forming portion 12A, and an arrangement,wherein scintillator 13 is sandwiched by scintillator forming portion12A and substrate 11, is employed. This substrate 11, scintillator 13,and scintillator forming portion 12A are covered by protective film 14.The present embodiment is of a mode wherein scintillator forming portion12A is not used as it is as the substrate and another substrate isprovided separately.

To describe the method of manufacturing scintillator panel 33 of thepresent embodiment, first, auxiliary substrate 20 is covered entirelywith organic film 12 in the same manner as in the manufacturing stepshown in FIG. 10A and FIG. 10B. Then as shown in FIG. 11A and FIG. 11B,scintillator 13 is formed on scintillator forming portion 12A. Whenscintillator 13 is formed, scintillator forming portion 12A of organicfilm 12 is separated from auxiliary substrate 20 as shown in FIG. 12.Then as shown in FIG. 14A, the exposed surface of scintillator 13 ismade to face substrate 11 side and scintillator 13 is set so as tocontact the surface of substrate 11. Substrate 11, scintillator 13, andscintillator forming portion 12A are then covered with protective film14.

Scintillator panel 33 can thus be manufactured. As with the embodimentsdescribed above, with scintillator panel 33 that is thus manufactured,substrate 11, which is thin, can be used, and even when a thin substrateis used, scintillator 13 can be formed uniformly.

A sixth embodiment of this invention shall now be described. FIG. 15A isa sectional view of a scintillator panel manufactured by a manufacturingmethod according to the present embodiment, and FIG. 15B is a front viewthereof. As shown in FIG. 15A and FIG. 15B, scintillator panel 35 hassubstrate 11. Scintillator forming portion 12A is set on substrate 11,and scintillator 13 is formed on scintillator forming portion 12A. Also,the surfaces of scintillator 13 and scintillator forming portion 12A arecovered by protective film 14.

To describe the method of manufacturing scintillator panel 35 of thepresent embodiment, first, as shown in FIG. 10A and FIG. 10B, auxiliarysubstrate 20 is prepared and auxiliary substrate 20 is covered withorganic film 12. The scintillator components are then vapor depositedonto scintillator forming portion 12A of organic film 12 to formscintillator 13 as shown in FIG. 11A and FIG. 11B. Up to this point, thepresent embodiment is the same as the third to fifth embodimentsdescribed above. In the present embodiment, after forming scintillator13 as shown in FIG. 16A and FIG. 16B, organic film 12, which coversauxiliary substrate 20, and scintillator 13 are covered with protectivefilm 14. Then as shown in FIG. 17, organic film 12 and protective film14 are cut to separate scintillator forming portion 12A of organic film12 and scintillator 13 from auxiliary substrate 20. Then as shown inFIG. 15A, scintillator forming portion 12A is mounted on substrate 11.Needless to say, the arrangement shown in FIG. 17, wherein scintillatorforming portion 12A and scintillator 13, which have been separated fromauxiliary substrate 20, are covered with protective film 14, can be usedas it is as a scintillator panel. In this case, scintillator formingportion 12A functions as the substrate.

With scintillator panel 35 thus manufactured, as with the respectiveembodiments described above, by using a thin substrate as substrate 11,the thickness of scintillator panel 35 itself can be made thin. Also,even if a thin substrate is used as substrate 11, since auxiliarysubstrate 20, which is thick, is used to prevent the warping and tearingof scintillator forming portion 12A in the process of formingscintillator 13, scintillator 13 can be formed uniformly on scintillatorforming portion 12A.

A seventh embodiment of this invention shall now be described. With thisembodiment, a method of manufacturing a radiation image sensor that usesa scintillator panel shall be described.

FIG. 18A is a sectional view of a radiation detector manufactured by themanufacturing method according to the present embodiment, and FIG. 18Bis a front view thereof as seen from the scintillator panel side. Asshown in FIG. 18A, radiation image sensor 40 of the present embodimenthas substrate 11. Substrate 11 is covered from its upper surface to itsside surfaces with organic film 12. Scintillator 13 is formed onscintillator forming portion 12A, which corresponds to being an upperportion of organic film 12. On scintillator 13 is mounted an imagepickup element 41. Substrate 11, organic film 12, scintillator 13, andimage pickup element 41 are covered by protective film 14. Furthermore,on portions of protective film 14 that cover the side walls ofscintillator 13 is disposed a sealing material 42, which is composed ofa resin with moisture-proof properties.

The method of manufacturing the radiation image sensor having the abovearrangement according to the present invention shall now be described.First, by the same procedures as those of the first embodiment,substrate 11 and auxiliary substrate 20 are overlapped (see FIG. 2A andFIG. 2B), substrate 11 and auxiliary substrate 20 are covered withorganic film 12 (see FIG. 3A and FIG. 3B), and thereafter, scintillator13 is formed on the surface of scintillator forming portion 12A (seeFIG. 4A, FIG. 4B, FIG. 5A, and FIG. 5B).

In forming scintillator 13, since substrate 11 is overlapped withauxiliary substrate 20, the warping of substrate 11 due to the weight ofsubstrate 11 itself and the weight of scintillator 13 is prevented as inthe respective embodiments described above, and scintillator 13 can thusbe formed uniformly.

When scintillator 13 is formed, scintillator 13 is set on image pickupelement 41 with the exposed surface of scintillator 13 and a lightreceiving surface of image pickup element 41 being made to face eachother as shown in FIG. 19A and FIG. 19B. By means of this image pickupelement 41, the light generated by scintillator emission of scintillator13 can be detected. Upon mounting image pickup element 41, organic film12, covering substrate 11 and auxiliary substrate 20, scintillator 13,and image pickup element 41 are covered with protective film 14 as shownin FIG. 20. Then as shown in FIG. 21, organic film 12 and protectivefilm 14 are cut at boundary portions (cut portions 12B and 14A) betweensubstrate 11 and auxiliary substrate 20 to separate substrate 11 fromauxiliary substrate 20 and thereby manufacture radiation image sensor40.

With radiation image sensor 40 thus manufactured, although thinsubstrate 11 is used, the warping of substrate 11 in the process offorming scintillator 13 is prevented by auxiliary substrate 20.Scintillator 13 can thus be formed uniformly. Since scintillator 13 isformed uniformly, the scintillator light that is obtained by the actionsof scintillator 13 will be uniform and favorable images can be obtainedby image pickup element 41.

The radiation image sensor is not limited to the above-described modeand may be manufactured by mounting the scintillator panel, manufacturedby any of the first embodiment to sixth embodiment described above, tothe light receiving surface of a solid-state image pickup element.Specifically, a radiation detector can be arranged by mounting, viaorganic film 14, the surface of scintillator 13 of scintillator panel 1of the first embodiment shown in FIG. 1 to the light receiving surfaceof the solid-state image pickup element. Also, a radiation detector canbe arranged by mounting, via organic film 14, the surface ofscintillator 13 of scintillator panel 2 shown in FIG. 8, the surface ofscintillator panel 3 or 30 of the third embodiment shown in FIG. 9A or9B, the surface of scintillator panel 32 of the fourth embodiment shownin FIG. 13A and FIG. 13B, or the surface of scintillator panel 35 of thesixth embodiment shown in FIG. 16A and FIG. 16B to the light receivingsurface of the solid-state image pickup element. By thus mounting thescintillator, not across the substrate but across organic film 14, tothe solid-state image pickup element, the layer interposed between thescintillator and the light receiving surface of the solid-state imagepickup element can be made thin. A radiation detector can also bearranged by mounting, via scintillator forming portion 12A and organicfilm 14, the surface of scintillator 13 of scintillator panel 33 of thefifth embodiment shown in FIG. 14A and FIG. 14B to the light receivingsurface of the solid-state image pickup element.

An eighth embodiment of the present invention shall now be described.FIG. 22A and FIG. 22B are sectional views of a radiation image sensor ofthe eighth embodiment of the present invention. Although with theabove-described embodiment, a solid-state image pickup element ismounted on a completed scintillator panel, with the present embodiment,a radiation detector is manufactured by mounting a solid-state imagepickup element to the scintillator of a scintillator panel prior tocompletion. As shown in FIG. 22A, with radiation image sensor 51 of thepresent embodiment, the surface of scintillator 13, used inmanufacturing scintillator panel 3 (FIG. 9A) of the third embodiment, ismounted on solid-state image pickup element 41. Although in the thirdembodiment, scintillator 13, shown in FIG. 12, and scintillator formingportion 31 are covered with organic film 14 to form scintillator panel3, here, after mounting the exposed surface of scintillator 13, shown inFIG. 12, to the light receiving surface of solid-state image pickupelement 41, scintillator 13, scintillator forming portion 31, andsolid-state image pickup element 41 are covered with organic film 14.Radiation image sensor 51, shown in FIG. 22A and FIG. 22B can thus bemanufactured. By this method, a thin radiation detector 51 can bemanufactured.

When scintillator 13 is to be mounted directly to the light receivingsurface of the solid-state image pickup element as in the presentembodiment wherein scintillator 13, shown in FIG. 12, or scintillator13, shown in FIG. 6, is to be mounted on the light receiving surface ofthe solid-state image pickup element, the scintillator and thesolid-state image pickup element are preferably coated with a protectivefilm. To perform coating with a protective film, the method disclosed inInternational Patent Application No. WO98/36920 pamphlet may be used.With this method, the protective film comprises: a first organic film,comprising parylene or other organic film; an inorganic film, comprisingan aluminum film; and a second organic film, which again comprisesparylene or other organic film. The first organic film is formed so asto cover the entire scintillator 13. The first organic film covers theentire scintillator 13 and attaches to the surface of scintillatorforming portion 12A, and the first organic film is in close contact withscintillator 13. The aluminum film is then vapor deposited onto thefirst organic film to form the inorganic film, and then the secondorganic film is formed on top. Corrosion of the inorganic film canthereby be prevented by the second organic film, and scintillator 13 canbe protected from deliquescence and other physical and chemicaldegradation, damage, etc.

Or, the method disclosed in International Patent application No.WO98/36291 pamphlet may be used. With this method, the protective filmcomprises: a first organic film, comprising parylene or other organicfilm; an inorganic film, comprising an aluminum film; and a secondorganic film, comprising parylene or other organic film. Prior toforming this protective film, a narrow, frame-like resin frame is formedat positions surrounding the periphery of scintillator 13 onscintillator forming portion 12A. In order to realize improved closecontact with the protective film, the resin frame is preferably subjectto a surface roughening process. This surface roughening process isperformed by scratching or forming small depressions in the surface,etc. The entire surface of scintillator forming portion 12A is thencovered along with the scintillator and the resin frame with the firstorganic film so as to cover scintillator 13. In this process, the firstorganic film is put in close contact with scintillator 13. The aluminumfilm is then formed on the surface of the first organic film to form theinorganic film and then the second organic film is formed on the surfaceof the inorganic film. By then cutting the protective film along thepriorly formed resin frame by a cutter, a protective film that coversscintillator 13 is formed.

A protective film that covers the scintillator can be formed favorablyby these methods.

A ninth embodiment of the present invention shall now be described. FIG.23A is a sectional view of a radiation detector according to the ninthembodiment of the present invention, and FIG. 23B is a front viewthereof as seen from the scintillator side. As shown in FIG. 23A andFIG. 23B, with the radiation detector 52 according to the presentembodiment, a surface of scintillator 13, used in manufacturing thescintillator panel of the sixth embodiment (see FIG. 15A and FIG. 15B),is mounted on a solid-state image pickup element. Whereas in the sixthembodiment, scintillator 13, shown in FIG. 17, is covered by organicfilm 14 and mounted on substrate 11, here, scintillator 13 is mountedonto the light receiving surface of solid-state image pickup element 41via organic film 14. Although in this mode, solid-state image pickupelement 41 is mounted at the opposite side of scintillator formingportion 12A, since scintillator forming portion 12A is not very thick, amode, wherein the scintillator forming portion 12A side is mounted onthe light receiving surface of solid-state image pickup element 41 isalso possible.

A tenth embodiment of the present invention shall now be described. FIG.24A is a sectional arrangement diagram of a scintillator panelmanufactured by a manufacturing method of this embodiment, and FIG. 24Bis a front view thereof as seen from the substrate 11 side. Althoughthis scintillator panel 36 has the same arrangement as that of the firstembodiment, it differs in that scintillator 13 is formed acrosssubstantially the entire scintillator forming surface. Incidentradiation can thus be converted to visible light, etc., across theentire surface of substrate 11.

The process for manufacturing this scintillator panel 36 shall now bedescribed with reference to FIG. 25A to FIG. 29. In manufacturing thisscintillator panel 36, a support substrate 20, shown in FIG. 25A andFIG. 25B, is used as auxiliary substrate. First, as shown in FIG. 25Aand FIG. 25B, substrate 11 is prepared, and upon making a first surface11B of substrate 11 contact one surface 20A of support substrate 20,substrate 11 and support substrate 20 are overlapped. As shown in FIG.25B, as support substrate 20, a substrate, which is thinner thansubstrate 11 and larger in area than substrate 11 in plan view, is used,and side portion 20B, which becomes a protruding portion of supportsubstrate 20, protrudes further to the sides than outer peripheral edges11C of substrate 11.

After substrate 11 and support substrate 20 have been overlapped,organic film 12, which covers the entire substrate 11 and supportsubstrate 20, is formed as shown in FIG. 26A and FIG. 26B. Organic film12 is formed by placing substrate 11 in a CVD device not shown in thefigure and performing CVD inside the CVD device. By forming organic film12 that covers substrate 11 and support substrate 20 in the state inwhich these are overlapped, substrate 11 and support substrate 20 aremaintained in a closely-contacting, overlapped state without beingadhered together, etc.

When organic film 12 has been formed with substrate 11 and supportsubstrate 20 being in an overlapped state, these are inserted insidevacuum vapor deposition device 80. Inside vacuum vapor deposition device80 is positioned a holding jig 81C, which is shown in FIG. 27A. Sideportion 20B of support substrate 20 is mounted on this holding jig 81C.Here, by positioning substrate 11 at the lower side of support substrate20, a state wherein substrate 11 is suspended from support substrate 20is realized. Substrate 11 is thereby held by holding jig 81C of vacuumvapor deposition device 80. The surface of substrate 11 that is coveredby organic film 12 is thus positioned so as to protrude from an opening81A of holding jig 81C into vapor deposition chamber 82 of vacuum vapordeposition device 80.

When substrate 11 is held by holding jig 81C, scintillator materials Mare supplied into vapor deposition chamber 80 below substrate 11 andgrown (deposited) by vapor deposition on the surface of substrate 11 toform scintillator 13. Here, the surface of organic film 12 correspondingto one surface 11A of substrate 11 does not contact holding jig 81C andis exposed across the entire surface as mentioned above. Scintillatormaterials M are thus vapor deposited across the entirety of the surfaceof organic film 12 that corresponds to substrate 11. As a result,scintillator 13 can be formed across the entire surface of organic film12 that corresponds to substrate 11. Also, end portions of the surfaceof organic film 12 that corresponds to substrate 11 are not held byholding jig 81C. The end portions of scintillator 13 will thus besubstantially perpendicular to this surface and the end portions ofscintillator 13 will not take on a sloped form.

After scintillator 13 has thus been formed, substrate 11 and supportsubstrate 20, covered by organic film 12, are removed from holding jig81C and taken outside vacuum vapor deposition device 80. Thereafter, theportions of organic film 12 near the portion of overlap of substrate 11and support substrate 12 are cut as shown in FIG. 29. When organic film12 is cut across the entire periphery of the portion of overlap ofsubstrate 11 and support substrate 12, substrate 11 and supportsubstrate 20 are freed from the state of being overlapped. Here, sincesupport substrate 20 is simply overlapped onto substrate 11, supportsubstrate 20 is removed as it is from substrate 11 by the cutting oforganic film 12.

After substrate 11 has been removed from support substrate 20,protective film 14 is formed so as to cover substrate 11, the remainingorganic film 12, and scintillator 13 as shown in FIG. 24A and FIG. 24B.As with the above-described organic film 12, protective film 14 isformed by CVD using the CVD device. By forming this protective film 14continuously across portions of scintillator 13 to portions of substrate11, contact of scintillator 13 with external air is prevented.

Scintillator panel 36 is thus manufactured. In forming scintillator 13on substrate 11 in this manufacturing process, the surface of organicfilm 12 corresponding to substrate 11 does not contact the holding jigof the vacuum vapor deposition device and this surface can be put in acompletely exposed state. Scintillator 13 can thus be formed across theentirety of the surface of organic film 12 that corresponds to substrate11. This can be used especially favorably in a scintillator panel fordentistry, with which the acquiring of images of as wide a range aspossible with a small substrate is demanded since the scintillator panelis inserted inside an oral cavity.

Also, since the end portions of scintillator 13 are made substantiallyperpendicular to the surface thereof and will not be sloped, in adheringthe image pickup element via organic film 12 onto scintillator 13 by anadhesive agent, the concentrating of the adhesive agent and distortionin the process of solidification of the adhesive agent can be prevented.

The results of an experiment performed to confirm the effects ofscintillator panel 36 of the present embodiment shall now be described.In order to confirm the effects of scintillator panel 36 of the presentembodiment, the present inventors conducted the following experiment. Asshown in FIG. 30A, a radiation image sensor 44, wherein an image pickupelement 43, comprising a CCD, is mounted on the one surface 11A side ofscintillator panel 36 of the above-described embodiment, wasmanufactured. An object D to be detected of substantially the same areaas substrate 11 was positioned at the other surface 11B side ofsubstrate 11 of this radiation image sensor 44, X-rays were madeincident on detection object D, and an image of detection object D wastaken by image pickup element 43.

Meanwhile, as a comparative example, conventional scintillator panel 60,shown in FIG. 38B, was covered with an organic film 12 and a radiationimage sensor 45, wherein image pickup element 43, comprising a CCD, ismounted on the one surface (scintillator vapor deposition surface) 61Aside of substrate 61, was manufactured as shown in FIG. 30B. Detectionobject D was positioned at the other surface 61B side at the sideopposite one surface (scintillator vapor deposition surface) 61A side ofsubstrate 61 of this radiation image sensor 45, X-rays were madeincident on detection object D, and an image of detection object D wastaken by image pickup element 43. Schematic views of the image taken bythe respective image pickup elements 43 are shown in FIG. 31A and FIG.31B, respectively.

As can be understood from FIG. 31A, with image P1, taken by radiationimage sensor 44 using scintillator panel 36 of the present embodiment,three dense lines L appeared clearly. On the other hand, with image P2,taken by radiation image sensor 45 using conventional scintillator panel60, three dense lines L, L and L appeared clearly at a central portion,however, portions F, F and F at which these lines are fuzzy, appeared atpositions close to the outer frame. These portions were found to beregions of low sensitivity. There was also a portion N along the outerframe at which image taking could not be performed at all. This portionwas found to be a non-sensitive region.

Thus with radiation image sensor 44, using scintillator panel 36 of thepresent embodiment, image taking of a clear image is enabled across theentire substrate in comparison to radiation image sensor 45, usingconventional scintillator panel 60.

Although in the above description, a plate that is wider than thesubstrate in both the longitudinal and lateral directions is used as thesupport substrate, by using a substrate 20, which protrudes fromsubstrate 11 in at least one direction as shown in FIG. 32, substrate 11can be supported in a suspended manner inside vapor deposition device 80using protruding portions 20B. Although a rectangular plate is usedhere, a support substrate of H-like shape or ladder shape may be usedinstead.

Also, the protruding portions are not limited to those of a horizontaldirection, and for example as shown in FIG. 33, protruding portions 25,which protrude from the surface of support substrate at the oppositeside of substrate 11 and in the opposite direction of substrate 11, maybe provided instead. In this case, holding portions 25A are provided inprotruding portions 25 and substrate 11 is supported in a suspendedmanner inside vapor deposition device 80 using these holding portions25A.

Furthermore, a support substrate that does not have protruding portionsmay be used. That is for example, a supporting substrate 20, with ashape having grooves 26, which are parallel to the surface, formed inopposing portions of side wall portion 20D as shown in FIG. 34A, orhaving parallel grooves 26 parallel to the surface in all four surfacesof side wall portion 20D as shown in FIG. 34B, may be used.

In using support substrate 20, shown in FIG. 34, after overlapping thissupport substrate 20 with substrate 11, the two components are put inclose contact by covering its entirety with organic film 12.

In this state, grooves (engaging portions) 26 are engaged with and heldby a holding jig 85 to hold substrate 11 in a suspended manner insidevapor deposition device 80, and then scintillator 13 is formed on thesurface of substrate 11 that is covered by organic film 12. Afterforming of the scintillator, by cutting organic film 12 to separatesupport substrate 20 and covering with protective film 14, scintillatorpanel 36, shown in FIG. 24A and FIG. 24B, is obtained.

Although preferred embodiments of the present invention have beendescribed above, this invention is not limited to the above-describedembodiments. For example, although in each of the above-describedembodiments, organic film 12 is formed directly on substrate 11(scintillator forming portion 12A), a mode, wherein a metal reflectingfilm 17 of the form of a thin film is formed between substrate 11 andorganic film 12 is also possible (see FIG. 37A). By forming this metalreflecting film 17, the luminance of the light emitted from thescintillator can be increased. Metal reflecting film 17 may be formed byvapor deposition on one surface of substrate 11 prior to the forming oforganic film 12 on the surface of substrate 11. Metals of various typescan be cited as the metal to be used as metal reflecting film 17 and,for example, a material containing a substance among the groupconsisting of Al, Ag, Cr, Cu, Ni, Ti, Mg, Rh, Pt, and Au may be used.

Besides being formed between substrate 11 and organic film 12, metalreflecting film 17 may be formed between organic film 12 andscintillator 13. When metal reflecting film 17 is to be formed betweenorganic film 12 and scintillator 13, it can be formed by covering thesurface of substrate 11 with organic film 12 and thereafter vapordepositing the metal onto the surface of organic film 12. A materialcontaining a metal substance in the list given above may be used in thismetal reflecting film 17 as well. Also, when metal reflecting film 17 isformed between organic film 12 and scintillator 13, since metalreflecting film 17 and scintillator 13 contact each other and metalreflecting film 17 may degrade due to the minute amount of watercontained in scintillator 13, a waterproofing film 18 may be formedbetween metal reflecting film 17 and scintillator 13 to prevent thisdegradation (see FIG. 37B). As waterproofing film 18, material of thesame substance as organic film 12 may be used. Also, an oxide film maybe formed on metal reflecting film and this may be used as waterproofingfilm 18.

With respect to the scintillator, metal reflecting film 17 is positionedin the direction opposite the direction in which the scintillatoremission is taken out.

Furthermore, although in the respective embodiments described above, aradiation transmitting substrate is used as substrate 11, a fiber-opticplate (FOP), which is a plate-like image transmitting body comprising aplurality of optical fibers, may be used in place of the radiationtransmitting substrate.

Also in regard to the radiation image sensor, modes wherein the imagepickup element is mounted on the scintillator were described, a modewherein the image pickup element is mounted on substrate 11 is alsopossible if the substrate transmits light of the emission wavelength ofthe scintillator as in the case of glass or FOP. A mode, wherein aradiation image sensor is arranged by mounting the image pickup elementto the scintillator panel as manufactured by any of the above-describedembodiments, is also possible.

Furthermore, although for each of the above-described embodiments, thecut portions of the organic film (scintillator forming portion), theprotective film, etc., are illustrated in the cut state, these cutportions may be smoothened, for example, by polishing. Especially in thecase of manufacturing a radiation detector, polishing, etc., ispreferably applied to make these cut portions smooth.

Also, although in the embodiments described above, CsI(Tl) is used asthe scintillator, this invention is not limited thereto, and forexample, CsI(Na), NaI(Tl), LiI(Eu), Ki(Tl), etc., may be used instead.

INDUSTRIAL APPLICABILITY

This invention is favorable for manufacturing radiation image sensorsand scintillator panels for radiation imaging that are large in area orare thin and, for example, is favorable for manufacturing radiationimage sensors and scintillator panels to be used in industrial andmedical fields.

1. A manufacturing method of a scintillator panel, wherein ascintillator is vapor deposited onto a substrate, comprising the stepsof: superpositioning an auxiliary substrate onto a predeterminedposition of a first surface of the substrate; collectively covering theentire superpositioned substrate and auxiliary substrate with an organicfilm; holding the substrate and the auxiliary substrate, which arecovered by the organic film, by means of a holding portion inside avapor deposition device; vapor depositing the scintillator onto asurface of the organic film that covers a second surface of thesubstrate at the side opposite the first surface in this state; andcutting the organic film at predetermined positions and separating thesubstrate from the auxiliary substrate to provide a scintillator panel,with which the organic film and the scintillator are formed on thesecond surface of the substrate.
 2. A manufacturing method of ascintillator panel, wherein a scintillator is vapor deposited onto anorganic film, comprising the steps of: covering at least a first surfaceof a predetermined auxiliary substrate with the organic film; holdingthe auxiliary substrate, covered by the organic film, by means of aholding portion inside a vapor deposition device so that the firstsurface of the auxiliary substrate is situated so as to be faced down inthe vapor deposition device; vapor depositing the scintillator onto apredetermined position of an exposed surface of the organic film at theside opposite the surface contacting the first surface of the auxiliarysubstrate in this state; separating the organic film, on which thescintillator is formed, from the auxiliary substrate; and covering thescintillator and organic film, now separated from the auxiliarysubstrate, with a protective film.
 3. The manufacturing method of thescintillator panel according to claim 1 or 2, wherein the auxiliarysubstrate has protruding portions that protrude to the outer sides ofthe substrate as viewed from the first surface side and is held by theholding portion inside the vapor deposition device by use of theseprotruding portions.
 4. The manufacturing method of the scintillatorpanel according to claim 1 or 2, wherein the auxiliary substrate hasprotruding portions that protrude in the thickness direction of thesubstrate and is held by the holding portion inside the vapor depositiondevice by use of these protruding portions.
 5. The manufacturing methodof the scintillator panel according to claim 1 or 2, wherein theauxiliary substrate has engaging portions at side wall portions and isheld by the holding portion inside the vapor deposition device by use ofthese engaging portions.
 6. A manufacturing method for a radiation imagesensor comprising the step of mounting the scintillator panel,manufactured by the manufacturing method of claim 1 or 2, onto a lightreceiving surface of a solid-state image pickup element.
 7. Amanufacturing method of a scintillator panel wherein a scintillator isvapor deposited onto an organic film, comprising the steps of: coveringat least a first surface of a predetermined auxiliary substrate with theorganic film; holding the auxiliary substrate, covered by the organicfilm, by means of a holding position inside a vapor deposition device sothat the first surface of the auxiliary substrate is situated so as tobe faced down in the vapor deposition device; vapor depositing thescintillator onto a predetermined position of an exposed surface of theorganic film at the side opposite the surface contacting the firstsurface of the auxiliary substrate in this state; separating the organicfilm, on which the scintillator is formed, from the auxiliary substrate;and setting and fixing the organic film on another substrate upon makingthe organic film surface, which was in contact with the first surface ofthe auxiliary substrate face the substrate.
 8. A manufacturing method ofa scintillator panel wherein a scintillator is vapor deposited onto anorganic film, comprising the steps of: covering at least a first surfaceof a predetermined auxiliary substrate with the organic film; holdingthe auxiliary substrate, covered by the organic film, by means of aholding position inside a vapor deposition device so that the firstsurface of the auxiliary substrate is situated so as to be faced down inthe vapor deposition device; vapor depositing the scintillator onto apredetermined position of an exposed surface of the organic film at theside opposite the surface contacting the first surface of the auxiliarysubstrate in this state; and setting and fixing the organic film onanother substrate upon making the scintillator forming surface of theorganic film face the substrate.
 9. The manufacturing method of thescintillator panel according to any one of claims 1, 7 and 8, furthercomprising the step of forming a protective film that covers thescintillator.
 10. The manufacturing method of the scintillator panelaccording to any one of claims 1, 7, and 8, wherein the substrate is aradiation transmitting substrate.
 11. The manufacturing method of thescintillator panel according to claim 10, wherein glass, aluminum, oramorphous carbon is used as the radiation transmitting substrate. 12.The manufacturing method of the scintillator panel according to any oneof claims 1, 7, and 8, further comprising the step of forming a metalreflecting film between the substrate and the scintillator.
 13. Themanufacturing method of the scintillator panel according to any one ofclaims 1, 7, and 8, wherein a fiber-optic plate is used as thesubstrate.
 14. The manufacturing method of the scintillator panelaccording to claim 7 or 8, further comprising the step of forming aprotective film that covers the scintillator after setting and fixingthe organic film upon the another substrate.
 15. A manufacturing methodof a radiation image sensor, having a structure wherein a solid-stateimage pickup element is mounted on a scintillator formed on a substrate,comprising the steps of: superpositioning an auxiliary substrate onto apredetermined position of a first surface of the substrate; collectivelycovering the entire superpositioned substrate and the auxiliarysubstrate with an organic film; holding the substrate and the auxiliarysubstrate, which are covered by the organic film, by means of a holdingportion inside a vapor deposition device; vapor depositing thescintillator onto a surface of the organic film that covers a secondsurface of the substrate at the side opposite the first surface in thisstate; cutting the organic film at predetermined positions andseparating the substrate from the auxiliary substrate to provide ascintillator panel, with which the organic film and the scintillator areformed on the second surface of the substrate; and adhering thescintillator panel onto a light receiving surface of the solid-stateimage pickup element.
 16. A manufacturing method of a radiation imagesensor, having a structure wherein a solid-state image pickup element ismounted on a scintillator formed on a substrate, comprising the stepsof: superpositioning an auxiliary substrate onto a predeterminedposition of a first surface of the substrate; collectively covering theentire superpositioned substrate and auxiliary substrate with an organicfilm; holding the substrate and the auxiliary substrate, which arecovered by the organic film, by means of a holding portion inside avapor deposition device; vapor depositing the scintillator onto asurface of the organic film that covers a second surface of thesubstrate at the side opposite the first surface in this state; adheringthe formed scintillator organic film to the solid-state image pickupelement with the scintillator forming surface facing the solid-stateimage pickup element; and cutting the organic film at predeterminedpositions and separating the substrate from the auxiliary substrate toprovide a radiation image sensor, having a scintillator panel positionedon the light receiving surface of the solid-state image pickup element.17. A manufacturing method of a radiation image sensor, having ascintillator layer on a light receiving surface of a solid-state imagepickup element, comprising the steps of: covering at least a firstsurface of a predetermined auxiliary substrate with an organic film;holding the auxiliary substrate, covered by the organic film, by meansof a holding portion inside a vapor deposition device so that the firstsurface of the auxiliary substrate is situated so as to be faced down inthe vapor deposition device; vapor depositing the scintillator onto apredetermined position of an exposed surface of the organic film at theside opposite the surface contacting the first surface of the auxiliarysubstrate in this state; separating the organic film, on which thescintillator is formed, from the auxiliary substrate; and adhering thesurface at the side opposite the scintillator forming surface of theorganic film, having the scintillator, onto the light receiving surfaceof the solid-state image pickup element.
 18. The manufacturing method ofthe radiation image sensor according to claim 15 or 17, furthercomprising the step of covering the exposed surface of the scintillatorwith a protective film.
 19. A manufacturing method of a radiation imagesensor, having a scintillator layer on a light receiving surface of asolid-state image pickup element, comprising the steps of: covering atleast a first surface of a predetermined auxiliary substrate with anorganic film; holding the auxiliary substrate, covered by the organicfilm, by means of a holding portion inside a vapor deposition device sothat the first surface of the auxiliary substrate is situated so as tobe faced down in the vapor deposition device; vapor depositing thescintillator onto a predetermined position of an exposed surface of theorganic film at the side opposite the surface contacting the firstsurface of the auxiliary substrate in this state; separating the organicfilm, on which the scintillator is formed, from the auxiliary substrate;and adhering the formed scintillator organic film to the solid-stateimage pickup element with the scintillator forming surface facingscintillator, the solid-state image pickup element.